Beilstein J. Nanotechnol.2012,3, 101–113, doi:10.3762/bjnano.3.11
using substrates with different surface morphologies, AFM measurements revealed that the roughness of the substrate is a crucial factor but not the only one determining the roughness of the copper surface that is exposed after lift-off.
Keywords: electrochemicalnanotechnology; electrodeposition
PDF
Figure 1:
(a) Scheme of SAM controlled electrodeposition and lift-off of metal structures. Starting from a un...